<div class="content-intro"><p><span data-teams="true">Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at <a id="menurhut" class="fui-Link ___1q1shib f2hkw1w f3rmtva f1ewtqcl fyind8e f1k6fduh f1w7gpdv fk6fouc fjoy568 figsok6 f1s184ao f1mk8lai fnbmjn9 f1o700av f13mvf36 f1cmlufx f9n3di6 f1ids18y f1tx3yz7 f1deo86v f1eh06m1 f1iescvh fhgqx19 f1olyrje f1p93eir f1nev41a f1h8hb77 f1lqvz6u f10aw75t fsle3fq f17ae5zn" href="http://www.asteralabs.com/" target="_blank">www.asteralabs.com</a>.</span></p></div><p><strong><span data-contrast="auto">Job Description</span></strong><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></p>
<p><span data-contrast="auto">We are seeking a Senior Packaging Integration Lead to serve as the single-threaded packaging owner for one or more of Astera Labs’ advanced connectivity products. This role owns the end-to-end packaging solution from customer requirements and package architecture definition through development, qualification, and production ramp & represents packaging across the customer, internal cross-functional teams, business units, and the OSAT, foundry, and substrate supply base.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></p>
<p><span data-contrast="auto">This is a senior individual-contributor technical leadership role who can set packaging technical direction, make architecture and technology-selection decisions, and drive alignment across stakeholders without direct authority. You will partner with packaging leadership on strategy while owning the technical direction for your products — defining package architecture and test vehicles to de-risk technology, and guiding execution engineers and external partners to deliver robust, manufacturable packages on schedule. </span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></p>
<p><strong><span data-contrast="auto">Key Responsibilities</span></strong><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></p>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="1" data-aria-level="1"><span data-contrast="auto">Own the packaging solution end-to-end for assigned products — serve as the single point of accountability from a packaging standpoint across definition, development, qualification, and production ramp</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="2" data-aria-level="1"><span data-contrast="auto">Act as the primary packaging interface to the customer: capture and translate customer packaging, mechanical, thermal, SIPI, and reliability requirements into package architecture, specifications, and a clear execution roadmap</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
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<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="3" data-aria-level="1"><span data-contrast="auto">Define package architecture, structure and technology selection (e.g., 2.5D/3D integration, chiplet/interposer, CoWoS-class, organic substrate) with feasibility, cost, performance, and manufacturability trade-off analysis</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
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<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="4" data-aria-level="1"><span data-contrast="auto">Define and drive test vehicle (TV) strategy and requirements to de-risk new package technology, characterize interconnect/SIPI performance, and validate assembly and reliability ahead of product builds</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="5" data-aria-level="1"><span data-contrast="auto">Represent packaging across internal cross-functional teams — silicon design, package design, SIPI, thermal, product engineering, test engineering, validation, quality, and operations — and align packaging requirements to product and business-unit roadmaps</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="6" data-aria-level="1"><span data-contrast="auto">Partner with product planning, architecture, and program management on product roadmap, packaging feasibility, technology readiness, cost targets, and schedule commitments</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
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<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="7" data-aria-level="1"><span data-contrast="auto">Set technical direction with OSAT, foundry & substrate partners — driving technology selection, design-rule alignment, and development roadmaps across the supply base</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
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<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="8" data-aria-level="1"><span data-contrast="auto">Own package definition deliverables and sign-offs, including POR/TOR, design rules, stack-up, package BOM, DFM alignment, and pre-tape-out design-integration readiness</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
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<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="9" data-aria-level="1"><span data-contrast="auto">Drive risk identification, technology-gap closure, and mitigation across the product’s packaging roadmap; escalate and resolve critical cross-functional and supplier issues with urgency.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
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<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="10" data-aria-level="1"><span data-contrast="auto">Communicate packaging status, risks, and key decisions to executive leadership, customers, and cross-functional stakeholders & external partners.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<p><strong><span data-contrast="auto">Basic Qualifications</span></strong><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></p>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="11" data-aria-level="1"><span data-contrast="auto">B.S. or M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related discipline; advanced degree preferred.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="12" data-aria-level="1"><strong><span data-contrast="auto">5-7+ yrs of experience in advanced packaging technologies such as 2.5D/3D integration, TSV, chiplets, and interposers. Optical / co-packaged optics experience is a plus.</span></strong><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
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<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="13" data-aria-level="1"><span data-contrast="auto">Demonstrated end-to-end ownership of a product or platform packaging solution, from definition and architecture through qualification and production ramp</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="14" data-aria-level="1"><span data-contrast="auto">Experience defining package architecture and driving technology selection, including trade-off analysis across performance, cost, reliability, and manufacturability</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="15" data-aria-level="1"><span data-contrast="auto">Experience defining test vehicles and characterization/qualification strategies to de-risk new packaging technology.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="16" data-aria-level="1"><span data-contrast="auto">Direct customer-facing experience translating product and system requirements into package specifications and commitments.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="17" data-aria-level="1"><span data-contrast="auto">Strong architecture-level understanding of signal/power integrity (SIPI), thermal, and thermo-mechanical reliability considerations in advanced packages</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="18" data-aria-level="1"><span data-contrast="auto">Proven ability to lead and influence across internal cross-functional teams, business units, and external OSAT/foundry/substrate partners without direct authority.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="19" data-aria-level="1"><span data-contrast="auto">Hands-on background working with foundries, OSATs, substrate suppliers, and material vendors.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="20" data-aria-level="1"><span data-contrast="auto">Excellent communication, organizational, and executive-level presentation skills, with the ability to drive alignment across globally distributed teams.</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<p><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></p>
<p><strong><span data-contrast="auto">Preferred Qualifications</span></strong><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></p>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="21" data-aria-level="1"><span data-contrast="auto">Experience with UCIe / die-to-die interconnect and high-bandwidth chiplet integration</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="22" data-aria-level="1"><span data-contrast="auto">Experience with CoWoS-class, silicon-bridge, or advanced fan-out packaging platforms</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="23" data-aria-level="1"><span data-contrast="auto">Experience with co-packaged optics / optical packaging for scale-up connectivity</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul>
<ul>
<li data-leveltext="•" data-font="Arial" data-listid="2" data-list-defn-props="{"335552541":1,"335559685":460,"335559991":260,"469769242":[8226],"469777803":"left","469777804":"•","469777815":"hybridMultilevel"}" data-aria-posinset="24" data-aria-level="1"><span data-contrast="auto">Track record engaging foundry and OSAT partners on advanced-packaging technology roadmaps</span><span data-ccp-props="{"335551550":6,"335551620":6,"335559738":144,"335559739":144,"335559745":60,"335559746":60}"> </span></li>
</ul><div class="content-conclusion"><p>We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.</p></div>