Job Description
Job Description
4/10 - 2nd (Mon-Thu), typically 4P-2A) : 3:30 PM-2:00 AM
Position Description
- Assemble, bond, and solder printed circuit boards.
- Must be able to read english and understand written work instructions.
- Must possess basic computer skills.
Skills Required
- Read, speak, and understand english.
- Must have basic computer knowledge.
Skills Preferred
- Soldering skills, Use of a microscope.
Experience Required
- Previous manufacturing.
Education Required
- GED and up
Education Preferred
- HS diploma
Additional Information
- Must be reliable, have good transportation, have a good work ethic.
\nCompany Description
With almost four decades of experience as a proven industry leader, Acro continues to be consistently recognized among the Best & Brightest Companies to Work for in the United States. As an international professional services firm with deep expertise in consulting and staff augmentation offering a variety of solutions including MSP, VMS, RPO, HRO (and more), Acro operates across North America, Europe, and Asia from over 30 locations. Acro’s client portfolio includes some of the most well-known names in business and provides services across all verticals including technology, aerospace, energy, automotive, government, and manufacturing. To learn more, please visit www.acrocorp.com.
Company Description
With almost four decades of experience as a proven industry leader, Acro continues to be consistently recognized among the Best & Brightest Companies to Work for in the United States. As an international professional services firm with deep expertise in consulting and staff augmentation offering a variety of solutions including MSP, VMS, RPO, HRO (and more), Acro operates across North America, Europe, and Asia from over 30 locations. Acro’s client portfolio includes some of the most well-known names in business and provides services across all verticals including technology, aerospace, energy, automotive, government, and manufacturing. To learn more, please visit www.acrocorp.com.