Process Engineer - Advanced Packaging

Job Description

Process Engineer – Advanced Packaging

Who We Are

Thintronics is solving one of the defining challenges in modern computing: moving massive amounts of data and power between chips at unprecedented speeds and densities. As Moore's Law slows, performance is increasingly defined by advanced packaging, chiplets, and high-density substrates. Our materials technology enables new levels of interconnect density, signal integrity, and power delivery inside next- generation semiconductor packages. We partner directly with leading IDMs, foundries, substrate manufacturers, and OSATs building the most advanced AI and HPC platforms in the world.

The Role

This is a hands-on process engineering role for engineers with deep experience in semiconductor packaging fabrication who want to be at the frontier of next-generation interconnect technology. You will own process integration and optimization as Thintronics materials are introduced into customer production flows — troubleshooting process excursions, designing and executing DOEs, and translating fab-floor findings into actionable feedback for R&D. You will work directly with substrate manufacturers, OSATs, and semiconductor companies with regular travel to customer sites.

Key responsibilities include:

• Process integration of Thintronics dielectric and conductor materials into FCBGA and advanced organic substrate fabrication flows
• Ownership of unit process steps including lamination, photolithography, dry/wet etch, and copper metallization
• Build-up layer process development and optimization for high-density interconnect structures
• Yield analysis, failure analysis, and root-cause investigation to drive continuous process improvement
• Electrical performance and reliability characterization in support of customer qualifications.
• Support pilot builds and production ramp activities at customer and partner fabs.
• Participation in technical process reviews with leading semiconductor companies.

Ideal Candidate

• You are a process-focused engineer who moves quickly from data to root cause to solution, and who is comfortable working directly on the fab floor alongside customer process teams. You thrive in a technically demanding, fast-moving startup environment and take ownership of outcomes.

Required

• BS, MS, or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or a related field
• 5+ years of hands-on process engineering experience in semiconductor packaging or substrate fabrication
• Direct, working-level experience with FCBGA or advanced organic substrate fabrication
• Demonstrated proficiency in substrate unit processes: lamination, photolithography, dry/wet etch, and copper metallization
• Strong analytical skills with experience designing and executing DOEs and interpreting process data

Highly Valued

• ABF substrate fabrication and high-density build-up layer process experience
• Experience with chiplet integration or 2.5D/3D packaging architectures
• Background in high-speed signal integrity, reliability testing, or qualification programs
• Prior experience at Ibiden, Unimicron, Shinko, Kyocera, ASE/SPIL, Amkor, PTI, or comparable substrate and OSAT organizations

Compensation

• Thintronics offers a competitive base salary commensurate with experience and qualifications. Compensation growth is tied to role performance and advancement, with clear opportunities for increase through promotion as the company scales.
• In addition to base salary, this role includes a grant of qualified stock options subject to standard vesting schedules.
• The base salary range for this position is $100,000–$160,000 per year. Actual compensation will depend on the candidate's experience, skills, and qualifications.
• This role also includes eligibility for a Thintronics' benefits package, including medical, dental, and vision insurance, 401(k), and paid time off.

Travel & Work Requirements

• Travel: This role requires approximately 25–30% travel to customer sites and partner fabs across Asia
• Travel eligibility: Candidates must be able to obtain and maintain valid passports, visas, and all required travel documents for business travel to the relevant countries
• Work authorization: Candidates must have authorization to work in the U.S. at the time of hire. Thintronics does not provide work visa sponsorship for this position
• Mobility: Ability to work effectively across multiple time zones and to travel on short notice as business priorities require

Thintronics is an equal opportunity employer. We do not discriminate based on race, color, religion, sex, national origin, age, disability, veteran status, or any other characteristic protected by applicable law.