Job Description
Job DescriptionSalary: $100,000
We are seeking a highly skilledManufacture Process Engineerto lead and optimize manufacturing processes forPrinted Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.
Key Responsibilities
- Process Development & Optimization
- Design, validate, and optimizestencil designsfor solder paste application.
- Develop and maintainreflow soldering profiles, includingvapor phase reflow processes, to ensure robust solder joints and minimize defects.
- Establish and refinewave soldering profilesfor through-hole components.
- Define and implementsecondary operationsincluding press-fit connector installation, heat sink attachment, and mechanical assembly steps.
- Develop and overseeconformal coating processesto ensure environmental protection and product reliability.
- Create and enforcerework standardsfor soldering, ensuring compliance with IPC and industry best practices.
- Manufacturing Support
- Provide technical leadership to production teams in troubleshooting assembly issues.
- Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.
- Drive yield improvement initiatives and root cause analysis for process-related defects.
- LeadCorrective and Preventive Action (CAPA)initiatives to eliminate recurring issues and strengthen process robustness.
- Support new product introduction (NPI) by developing scalable and repeatable assembly processes.
- Quality & Compliance
- Ensure adherence to IPC-A-610, J-STD-001, IPC-7711/7721, and other relevant industry standards.
- Maintain documentation of process parameters, work instructions, and control plans.
- Partner with quality engineering to implement corrective and preventive actions (CAPA).
- Continuous Improvement
- Lead projects focused on automation, efficiency, and cost reduction.
- Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.
- Train and mentor junior engineers and technicians in advanced assembly techniques.
Qualifications & Experience
- Education: Bachelors degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Masters preferred.
- Experience: Minimum710 yearsin PCBA manufacturing engineering, with proven expertise in:
- Stencil designand solder paste application.
- Reflow soldering(includingvapor phase reflow) and thermal profiling.
- Wave solderingprocess development and optimization.
- Conformal coatingapplication and process control.
- Secondary operations(press-fit connectors, heat sinks, mechanical assembly).
- Rework and repair standardsfor solder joints.
- Root cause analysisandCAPA methodologiesfor troubleshooting and issue resolution.
- Strong knowledge ofIPC standards(IPC-A-610, J-STD-001, IPC-7711/7721).
- Hands-on experience with SMT equipment, AOI/X-ray inspection, and process monitoring tools.
- Demonstrated success inNPI process developmentand scaling to volume production.
- Excellent problem-solving, analytical, and communication skills.
- Ability to lead cross-functional teams and drive process improvements in a fast-paced environment.
Preferred Skills
- Experience withDesign for Manufacturability (DFM)andDesign for Test (DFT)principles.
- Familiarity withLean ManufacturingandSix Sigmamethodologies.
- Proficiency in CAD tools for stencil and fixture design.
- Knowledge of advanced soldering techniques (selective soldering, laser soldering).
- Strong project management and leadership capabilities.