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Packaging Design Engineer - Rigid Food Grade

Advanced Materials & Technology Recruiting
locationE Clare Rd, Mayfield Township, IL 60111, USA
PublishedPublished: 6/14/2022
Manufacturing
Full Time

Job Description

Job Title: Packaging Design Engineer


Industry: Thermoformed Food Grade and Consumer Grade Rigid Packaging Products


Location: On-site in the DeKalb, IL Area


Position Brief:

The Chatham Group Advanced Materials and Technologies Recruiting Team is seeking highly qualified candidates for a Packaging Design Engineer for a client in the specialty packaging technology industry. This is a mid-junior level position that requires hands-on experience with rigid thermoformed packaging design concepts with experience in sustainable food grade and/or consumer packaging technology and manufacturing methods. You will work closely with the manufacturing engineering and quality assurance teams to deliver compliant and production ready packaging solutions for new and existing products.


Responsibilities:


  • Design food device packaging systems from initial concept through testing and production using CAD programs, particularly SolidWorks
  • Focus on Thermoforming technologies to develop portion-separated trays, blister packs, tubs, clamshells, etc
  • Use CAD programs to develop 3D models and assemblies as well as 2D drawings for specification
  • Evaluate various polymeric materials such as PET, HIPS, PVC, etc for their performance properties such as wall thickness, strength, rigidity, and more
  • Create prototype products using new or existing tooling, and/or 3D printing technologies and conduct feasibility reviews for functional integrity, stackability, etc
  • Lead the IQ/OQ/PQ product validation process and comply with ISO manufacturing quality standards


Requirements:

  • BS in Packaging Engineering, Packaging Science, Mechanical Engineering, or other highly relevant field
  • 3+ years of experience in packaging design preferably in thermoformed food grade or consumer packaging
  • High proficiency with CAD programs, particularly SolidWorks
  • Working knowledge of thin-gauge thermoformed packing design
  • Understanding of product lifecycle and circularity in packaging design
  • Ability to conduct market research and potentially attend trade shows


Compensation will be commensurate with experience and relocation may be provided to qualified candidates.

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